In addition to driving the automotive processor, microcontrollers and all kinds of sensor market is booming, the demand for power management chips is also rising. Among them, the use of a large number of sensors to the advanced driving assistance system for the power management chip to create the new demand is most impressive. As the car is equipped with more and more types of electronic subsystems, power management chips in the field of automotive applications also continue to expand. From the car-based communications entertainment systems, navigation systems Sensor and other traditional applications, and now the most popular electric cars, ADAS, self-driving, etc., will be applied to the power management chip. Especially ADAS, because it is necessary to collect real-time data through sensors scattered throughout the body, and each sensor module must be equipped with the corresponding power chip, so the growth space is quite worth the wait.
The sensor module has a linear regulator to adjust the power transmitted from the main power supply, to avoid the power in the long transmission process coupled with some of the noise, the sensor module is equipped with a linear regulator to adjust the power from the main power supply, Thus affecting the operation of the sensor. In fact, a similar design concept has long appeared Temperature Sensor on a laptop or a two-in-one device. Such as notebook computer screen at the top of the video lens module, it is generally equipped with LDO, to ensure that the power quality is stable, otherwise the video camera images are prone to snow and other noise.
Compared to notebook computers and other consumer applications, for the car market, Ricoh has a corresponding power management with the LDO product line. And Ricoh for car assembly components, but also further subdivided into Rank1 to Rank3 three grades, which, Rank1 components in the wafer with the final test, have been fully tested to ensure the stability Speed Sensor of the components with the reliability, to meet the car Critical systems or core systems for the most stringent requirements for quality; as for some less impact on the safety of electronic sub-systems or peripheral products, you can consider the use of Rank2 or Rank3 level components in order to reduce costs. In the sensor layer, the network layer and application layer have a certain technical reserves, in some areas such as automotive afterload tracking module global shipments have reached the level of 10 million. With the next generation of communication standards, the industry will usher in explosive growth.