More convincing figure is that in 2016 the world's top 50 Fabless enterprises, the number of Chinese design enterprises to 11, respectively, Shenzhen Haisi, purple show sharp, Datang Microelectronics, South Rui Chi core, China Huada, ZTE, Tintai Technology, Silan Micro, Granville, Zhuhai, Chi, montage and so on. Among them, Shenzhen Haisi sales scale Sensor has reached 30 billion yuan, purple show sharp to 12.5 billion, the two enterprises have over ten billion in size has successfully entered the global Fabless top 10.

Purple show sharp design level has reached 16/14 nm. The world's 1/4 of the mobile phones are used Spreadtrum chips, Spreadtrum in 2016 chip shipments have reached 600 million units, sales of 12 billion yuan. In the baseband chip, Spreadtrum has been and Qualcomm, MediaTek third of the world, 2016 market share of 27%. At present, Spreadtrum is using Intel technology, TSMC foundry 'two legs to walk' mode of cooperation. Spreadtrum launched this year, two new products Fuel Rail Pressure Sensor by the Intel OEM, Intel-based 14-nanometer X86 mobile chip, respectively, for the high-end market and low-end market.

Intel's technology provides a powerful program, so that show off enough to face the future of more mobile phone applications and high computing demand. And Haisi successfully launched with Qualcomm 'Xiao Long' chip performance quite 'unicorn' chip. Kylin 910 for the first time integrated self-research Balong 710 baseband, as a real sense of the mobile SoC; from Kirin 920, Haisi began to launch with Qualcomm and Samsung processor a higher product, far off MediaTek. 'Kirin' chip has been used in the Huawei Mate series, a strong support for the development of Huawei's high-end smart phones. According to China's integrated circuit industry, 'thirteen five' development plan recommendations on the integrated circuit design industry planning, by 2020, the national integrated circuit design industry annual sales revenue fuel metering valve will reach 390 billion yuan, the industrial scale of the national IC industry ratio of 41.9% The In accordance with the current development trend of China's IC design industry, to achieve this goal should be difficult.

But China's IC design industry is still the overall level of technology is not high, the core product innovation is weak, the product is generally in the low-end, the enterprise competitive strength is not strong, brutal growth traces and other issues, China Resources Microelectronics Co., Ltd. Chen Nanxiang, Particularly noteworthy is that in the field of high-end chips, China and the international gap is particularly large. In the field of high-end Temperature Sensor chip to catch up with the international advanced level, will be the next period of China's IC industry, one of the main tasks.

  Driven by investment-driven, China's IC manufacturing capacity is a big step expansion. According to the report released by the International Semiconductor Equipment and Materials Industry Association (SEMI), 26 of the 62 semiconductor fabs scheduled for operation between 2017 and 2020 are in China at the planning or construction stage, 42%. By 2017, these new fabs in China are expected to have six on-line production, peaked in 2018, a total of 13 fabs to join the operation, most of them for the foundry. See so many wafers launched, the industry appeared on the concerns of overheating investment. Tsinghua University, microelectronics Professor Wei Shaojun pointed out: 'From the supply and demand gap and trade deficit, our self-sufficiency ABS Sensor rate of only 13.5%, from the total capacity point of view, did not exceed expectations, there is no excess capacity problem; but the layout is scattered, unable to scale Effects, local areas and local technical nodes may indeed be local excess capacity.

The increase in capacity to relatively high-end technology-based. The newly expanded capacity will effectively meet the huge demand of China's IC design industry. And Gartner pointed out that the next five years, some international non-factory semiconductor companies may also be up to 50% of the wafer procurement needs to China's foundries. Manufacturing industry will obviously be an important driving force for the rapid growth of China's IC industry.

  This series of M \u0026 A actions reflect the pace of China's packaging and testing industry towards the high-end market is accelerating. In the IC industry chain, the initial closure of the industry, technology and capital threshold is relatively low, belonging to the industrial chain in the 'labor-intensive.' As China's development of integrated circuit packaging industry has a cost advantage, the development of packaging and testing industry is relatively early. Sealing industry long-term occupation of China's IC industry half of the country. It is because of the lower threshold of technology and capital, China's IC packaging and testing enterprises, enterprises are widely distributed, the industrial structure is also more complex, not only have long power technology, through the rich micro-electricity, Tianshui Huatian such a first echelon of the enterprise , There are also Throttle Position Sensor a certain degree of technological innovation, the rapid growth of the medium-sized second-tier enterprises, the main advantages of such enterprises in the low cost and cost-effective; third tier is the technology and market size are weak small businesses, the lack of stability Sales revenue, but the largest number of enterprises.

However, these years with smart phones, tablet PCs, mobile TV and other smart consumer electronics products, strong market demand, the chip design and manufacturing and packaging have put forward higher requirements. Integrated circuit technology has been developed from 0.13 microns to 40 nanometers to 28 nanometers or even 14 nanometers and below, and domestic packaging companies are bound to develop complementary packaging technologies to meet miniaturization, versatility, high density, and high cost of consumer electronics Reliable and low cost requirements. Industry differentiation trend is obvious, leading enterprises to the high-end evolution is the trend of the times.

In 2010, the company will acquire a series of advanced packaging technologies such as SiP and FoWLP. If we can successfully integrate Star Branch Jinpeng and import new customers, we will acquire the new packaging technology. , Is expected to shoulder to shoulder the global leader in packaging and testing 'ASE + silicon products.' Tongfu microelectronics earlier cut into the field of automotive electronics packaging and testing, after more than 10 years of accumulation, already have a unique product technology and large-scale production capacity. The company's automotive electronics products to the engine ignition module, the engine control unit, control circuit, Hall sensors, acceleration sensors and so on. After the acquisition Pressure Switch of AMD Suzhou, Penang two plants, the two factories advanced flip chip IC packaging and testing technology and through the micro-technology complementary technology, will enhance the proportion of advanced packaging sales revenue.

Huatian technology in Kunshan, Xi'an, Tianshui three layout, which Kunshan plant, the main high-end technology, in the acquisition of FCI, the main wafer-level high-end packaging, revenue capacity can also be greatly improved.